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Functional Architecture Intel® Compute Module MFS5520VI TPS

Revision 1.3

Intel order number: E64311-005

3.1.6 Unified Retention System Support

The Compute Module complies with Intel’s Unified Retention System (URS) and the Unified

Backplate Assembly. The Compute Module ships with a made-up assembly of Independent

Loading Mechanism (ILM) and Unified Backplate at each processor socket.

The URS retention transfers load to the Compute Module through the unified backplate

assembly. The URS spring, captive in the heatsink, provides the necessary compressive load

for the thermal interface material. All components of the URS heatsink solution are captive to

the heatsink and only require a Philips* screwdriver to attach to the unified backplate assembly.

See the following figure for the stacking order of the URS components.

AF002699

Heatsink

Screw

Compression Spring

Retention Cup

Thermal Interface Material (TIM)

Retaining Ring

Server Board

Heatsink

Attach Studs

ILM Attach Studs

Unified Backplate

ILM and Socket

Figure 5. Unified Retention System and Unified Backplate Assembly

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Intel MFS5520VI Fiche technique Page 16