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Datasheet 45

Land Listing and Signal Descriptions

4 Land Listing and Signal

Descriptions

This chapter provides the processor land assignment and signal descriptions.

4.1 Processor Land Assignments

This section contains the land listings for the processor. The land-out footprint is shown

in Figure 17 and Figure 18. These figures represent the land-out arranged by land

number and they show the physical location of each signal on the package land array

(top view). Table 23 provides a listing of all processor lands ordered alphabetically by

land (signal) name. Table 24 provides a listing of all processor lands ordered by land

number.

1 2 ... 40 41 42 43 44 45 46 47 48 49 50 ... 117 118

Datasheet 1
2 Datasheet 2
Contents 3
4 Datasheet 4
Datasheet 5 5
6 Datasheet 6
Revision History 7
8 Datasheet 8
Datasheet 9 9
10 Datasheet 10
1 Introduction 11
1.1 Terminology 12
Datasheet 13 13
Introduction 13
1.2 References 14
2.1 Power and Ground Lands 15
2.2 Decoupling Guidelines 15
2.3 Voltage Identification 16
Datasheet 17 17
Electrical Specifications 17
18 Datasheet 18
Datasheet 19 19
20 Datasheet 20
Datasheet 21 21
1, 2, 3, 4 22
Figure 1. V 23
Overshoot 24
2.6.4 Die Voltage Validation 24
2.7 Signaling Specifications 25
26 Datasheet 26
Datasheet 27 27
28 Datasheet 28
2.7.4 Clock Specifications 29
30 Datasheet 30
Datasheet 31 31
VHavg (mV) 32
250 + 0.5 (VHavg - 700) 32
550 + 0.5 (VHavg - 700) 32
2.8 PECI DC Specifications 33
34 Datasheet 34
3 Package Mechanical 35
36 Datasheet 36
Datasheet 37 37
38 Datasheet 38
INTEL® CORE™2 DUO 40
SLxxx [COO] 40
3.00GHZ/4M/1333/06 40
Datasheet 41 41
2.20GHZ/2M/800/06 42
Preliminary 43
Socket 775 43
Quadrants 43
Top View 43
44 Datasheet 44
4 Land Listing and Signal 45
Descriptions 45
46 Datasheet 46
Datasheet 47 47
Table 23. Alphabetical Land 48
Assignments 48
Table 24. Numerical Land 58
Assignment 58
68 Datasheet 68
Datasheet 69 69
70 Datasheet 70
Datasheet 71 71
72 Datasheet 72
Datasheet 73 73
74 Datasheet 74
Datasheet 75 75
76 Datasheet 76
5 Thermal Specifications and 77
Design Considerations 77
Table 27. Thermal Profile 1 79
Figure 19. Thermal Profile 1 79
Table 28. Thermal Profile 2 80
Figure 20. Thermal Profile 2 80
Table 29. Thermal Profile 3 81
Figure 21. Thermal Profile 3 81
Table 30. Thermal Profile 4 82
Figure 22. Thermal Profile 4 82
Table 31. Thermal Profile 5 83
Figure 23. Thermal Profile 5 83
84 Datasheet 84
5.2.2 Thermal Monitor 2 85
86 Datasheet 86
5.2.4 PROCHOT# Signal 87
5.2.5 THERMTRIP# Signal 87
5.3 Thermal Diode 88
Datasheet 89 89
PECI Host 90
Controller 90
Domain 0 90
Datasheet 91 91
5.4.2.1 PECI Device Address 92
5.4.2.2 PECI Command Support 92
6 Features 93
6.2.2.1 HALT Powerdown State 94
6.2.3.1 Stop Grant State 95
6.3 Enhanced Intel 96
SpeedStep 96
Technology 96
Datasheet 97 97
Features 97
98 Datasheet 98
Datasheet 99 99
7.1 Mechanical Specifications 100
7.2 Electrical Requirements 101
BdP PCbl 102
7.3 Thermal Specifications 103
104 Datasheet 104
Datasheet 105 105
106 Datasheet 106
(BTX) Boxed Processor 107
Specifications 107
8.1 Mechanical Specifications 108
Datasheet 109 109
110 Datasheet 110
Datasheet 111 111
8.2 Electrical Requirements 112
(hatched area) 113
8.3 Thermal Specifications 114
Datasheet 115 115
116 Datasheet 116
9 Debug Tools Specifications 117
Debug Tools Specifications 118
118 Datasheet 118

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