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Balanced Technology Extended (BTX) Boxed Processor Specifications

108 Datasheet

NOTE: The duct, clip, heatsink and fan can differ from this drawing representation but

the basic shape and size will remain the same.

8.1 Mechanical Specifications

8.1.1 Balanced Technology Extended (BTX) Type I and Type II

Boxed Processor Cooling Solution Dimensions

This section documents the mechanical specifications of the boxed processor TMA. The

boxed processor will be shipped with an unattached TMA. Figure 41 shows a

mechanical representation of the boxed processor in the 775-land LGA package for

Type I TMA. Figure 42 shows a mechanical representation of the boxed processor in the

775-land LGA package for Type II TMA. The physical space requirements and

dimensions for the boxed processor with assembled fan thermal module are shown.

Figure 40. Mechanical Representation of the Boxed Processor with a Type II TMA

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Intel SLA9X Fiche technique Page 108