Intel BX80570E8200A manuels

Intel BX80570E8200A Fiche technique (128 pages)

marque: Intel | Catégorie: Processeurs | Taille: 3.30 MB |

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Table des matières

Contents

3

Figures

6

Revision History

9

1 Introduction

11

1.1.3 Document Scope

12

1.2 References

13

1.3 Definition of Terms

13

 measurements

14

Information

15

2.1.2 Heatsink Attach

17

2.2 Thermal Requirements

18

2.2.2 Thermal Profile

19

2.2.4 T

20

7, Intel

21

2.3.4 and

21

2.3.1 Heatsink Size

22

2.3.2 Heatsink Mass

22

2.3.3 Package IHS Flatness

23

2.4.3 Summary

25

3 Thermal Metrology

27

3.1.1 Example

28

Assessment

29

Guidelines

29

3-3. The

30

Thermal Metrology

31

Thermal Monitor Feature

33

4.2.1 PROCHOT# Signal

34

4.2.3 Thermal Monitor 2

35

4.2.5 On-Demand Mode

37

4.2.6 System Considerations

37

Considerations

38

4.2.8 THERMTRIP# Signal

38

7 and the Intel

40

(BTX) Thermal/Mechanical

41

Design Information

41

5.1.2 Acoustics

42

5.1.3 Effective Fan Curve

43

Airflow (cfm)

44

5.1.5 Altitude

45

5-2. Random Vibration PSD

46

5.2.2 Power Cycling

47

5.4 Safety Requirements

49

Thermal Module Assembly

49

Detail A

52

Detail B

52

6 ATX Thermal/Mechanical

53

Appendix H

54

6.2.1 Heatsink Performance

55

6.2.2 Acoustics

56

6.2.3 Altitude

56

3.3 and 6.6)

57

6-3. Random Vibration PSD

58

6.3.2 Power Cycling

59

6.5 Safety Requirements

61

Thermal Mechanical Design

61

Less curvature in

62

Shock Load

62

Core shoulder

63

7 Intel

65

Quiet System

65

Technology (Intel

65

7-1. Intel

66

RPM Temperature

67

7-3 and listed below:

68

7-3. Intel

68

7.3 Intel

70

A.3.1, and A.3.2

76

Metrology

77

B.1 Overview

77

B.2 Test Preparation

77

Heatsink Clip Load Metrology

78

Load Cells (3x)

79

Preload Fixture (copper

79

B.3 Test Procedure Examples

80

Measurement

81

Appendix C Thermal Interface

83

Management

83

C.1 Bond Line Management

83

C.2 Interface Material Area

83

Thermal Interface Management

84

Appendix D Case Temperature

85

Reference Metrology

85

D.1 Objective and Scope

85

7-11. Order

86

7-11. Omega Thermocouple

86

D.4 IHS Groove

87

7-14 for the 775-Land

90

D.2 and D.3

91

7-16)

91

7-17)

91

7-19-A and B)

92

TC Wire with Insulation

94

IHS with Groove

94

7-24)

95

7-25)

96

7-25. Cutting Solder

96

7-26)

96

D.5.3 Solder Process

97

7-27. Solder Station Setup

98

7-28 and Figure 7-29)

98

Installation

100

7-32)

101

7-33)

101

7-34)

102

7-36)

103

Extended (BTX) System

105

Thermal Considerations

105

Thermal

107

MCH Heatsink

107

Reference Design

109

BOARD PRIMARY SIDE

112

BOARD SECONDARY SIDE

113

Mechanical Drawings

114

Figure 7-54. Intel

126

Appendix H Intel

127

Enabled Reference

127

Solution Information

127

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