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Electrical Specifications

30 Datasheet

5. 800-MHz FSB supported

6. Measured at the bulk capacitors on the motherboard.

7. Based on simulations and averaged over the duration of any change in current. Specified by design/

characterization at nominal V

. Not 100% tested.

8. This is a power-up peak current specification, which is applicable when V

CCP

is high and V

core is low.

9. This is a steady-state Icc current specification, which is applicable when both V

CCP

and V

core are high.

10. SU2300 processor operates at same core frequency in HFM and LFM.

1. Unless otherwise noted, all specifications in this table apply to all processor frequencies.

2. Crossing Voltage is defined as absolute voltage where rising edge of BCLK0 is equal to the

falling edge of BCLK1.

3. For Vin between 0 V and V

4. Cpad includes die capacitance only. No package parasitics are included.

5. ΔV

CROSS

is defined as the total variation of all crossing voltages as defined in Note 2.

6. Measurement taken from differential waveform.

7. Measurement taken from single-ended waveform.

8. Only applies to the differential rising edge (Clock rising and Clock# falling).

Table 9. FSB Differential BCLK Specifications

Symbol Parameter Min Typ Max Unit Notes

CROSS

Crossing Voltage 0.3 0.55 V 2, 7, 8

ΔV

CROSS

Range of Crossing Points 140 mV 2, 7, 5

SWING

Differential Output Swing 300 mV 6

Input Leakage Current -5 +5 µA 3

Cpad Pad Capacitance 0.95 1.2 1.45 pF 4

1 2 ... 25 26 27 28 29 30 31 32 33 34 35 ... 97 98

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Intel T1700 Fiche technique Page 30