Intel S1155 Manuel d'utilisateur

Document Number: 324973-001 Intel® Xeon ® Processor E3-1200 Product Family and LGA 1155 SocketThermal/Mechanical Specifications and Design Guidelines

Introduction10 Thermal/Mechanical Specifications and Design Guidelines1.1 ReferencesMaterial and concepts available in the following documents may be

Mechanical Drawings100 Thermal/Mechanical Specifications and Design GuidelinesFigure B-5. 1U Collaboration Heatsink AssemblyA4B3CD4321A2C1DAAE49069 1

Thermal/Mechanical Specifications and Design Guidelines 101Mechanical Drawings(Figure B-6. 1U Collaboration HeatsinkA4B3CD4321A2C1DE49059 1 CDWG. NO

Mechanical Drawings102 Thermal/Mechanical Specifications and Design GuidelinesFigure B-7. 1U Reference Heatsink Assembly

Thermal/Mechanical Specifications and Design Guidelines 103Mechanical DrawingsFigure B-8. 1U Reference Heatsink

Mechanical Drawings104 Thermal/Mechanical Specifications and Design GuidelinesFigure B-9. 1U Heatsink ScrewA4B3CD4321A2C1DAAE50686 1 BDWG. NO SHT. RE

Thermal/Mechanical Specifications and Design Guidelines 105Mechanical DrawingsFigure B-10. Heatsink Compression Spring

Mechanical Drawings106 Thermal/Mechanical Specifications and Design GuidelinesFigure B-11. Heatsink Load Cup

Thermal/Mechanical Specifications and Design Guidelines 107Mechanical DrawingsFigure B-12. Heatsink Retaining Ring

Mechanical Drawings108 Thermal/Mechanical Specifications and Design GuidelinesFigure B-13. Heatsink Backplate AssemblyA4B3CD4321A2C1DAAE49060-0011CDWG

Thermal/Mechanical Specifications and Design Guidelines 109Mechanical DrawingsFigure B-14. Heatsink Backplate

Thermal/Mechanical Specifications and Design Guidelines 11Introduction§TCASE_MAXThe maximum case temperature as specified in a component specification

Mechanical Drawings110 Thermal/Mechanical Specifications and Design GuidelinesFigure B-15. Heatsink Backplate Insulator

Thermal/Mechanical Specifications and Design Guidelines 111Mechanical DrawingsFigure B-16. Heatsink Backplate StudA4B3CD4321A2C1DA AFOXHOLLOW_THICK_BP

Mechanical Drawings112 Thermal/Mechanical Specifications and Design GuidelinesFigure B-17. Thermocouple Attach DrawingAACDPACKAGE CENTERREFERENCED FRO

Thermal/Mechanical Specifications and Design Guidelines 113Mechanical DrawingsFigure B-18. 1U ILM Shoulder Screw8 7

Mechanical Drawings114 Thermal/Mechanical Specifications and Design Guidelines§Figure B-19. 1U ILM Standard 6-32 Thread Fastener8 7

Thermal/Mechanical Specifications and Design Guidelines 115Socket Mechanical DrawingsC Socket Mechanical DrawingsTa b l e C- 1 lists the mechanical d

Socket Mechanical Drawings116 Thermal/Mechanical Specifications and Design GuidelinesDocument Number: 448776 Rev. 2.0Figure C-1. Socket Mechanical Dr

Thermal/Mechanical Specifications and Design Guidelines 117Socket Mechanical DrawingsFigure C-2. Socket Mechanical Drawing (Sheet 2 of 4)

Socket Mechanical Drawings118 Thermal/Mechanical Specifications and Design GuidelinesDocument Number: 448776 Rev. 2.0(Figure C-3. Socket Mechanical D

Thermal/Mechanical Specifications and Design Guidelines 119Socket Mechanical Drawings§Figure C-4. Socket Mechanical Drawing (Sheet 4 of 4)

Introduction12 Thermal/Mechanical Specifications and Design Guidelines

Socket Mechanical Drawings120 Thermal/Mechanical Specifications and Design GuidelinesDocument Number: 448776 Rev. 2.0

Thermal/Mechanical Specifications and Design Guidelines 121Package Mechanical DrawingsD Package Mechanical DrawingsTa b l e D- 1 lists the mechanical

Package Mechanical Drawings122 Thermal/Mechanical Specifications and Design GuidelinesFigure D-1. Processor Package Drawing (Sheet 1 of 2)

Thermal/Mechanical Specifications and Design Guidelines 123Package Mechanical Drawings§Figure D-2. Processor Package Drawing (Sheet 2of 2).

Package Mechanical Drawings124 Thermal/Mechanical Specifications and Design Guidelines

Thermal/Mechanical Specifications and Design Guidelines 13Package Mechanical & Storage Specifications2 Package Mechanical & Storage Specificat

Package Mechanical & Storage Specifications14 Thermal/Mechanical Specifications and Design Guidelines2.1.1 Package Mechanical DrawingFigure 2-2 sh

Thermal/Mechanical Specifications and Design Guidelines 15Package Mechanical & Storage Specifications2.1.3 Package Loading SpecificationsTa b l e

Package Mechanical & Storage Specifications16 Thermal/Mechanical Specifications and Design Guidelines2.1.7 Processor MaterialsTab le 2-3 lists so

Thermal/Mechanical Specifications and Design Guidelines 17Package Mechanical & Storage Specifications2.1.9 Processor Land CoordinatesFigure 2-4 sh

Package Mechanical & Storage Specifications18 Thermal/Mechanical Specifications and Design Guidelines2.2 Processor Storage SpecificationsTab le 2

Thermal/Mechanical Specifications and Design Guidelines 19LGA1155 Socket3 LGA1155 SocketThis chapter describes a surface mount, LGA (Land Grid Array)

2 Thermal/Mechanical Specifications and Design GuidelinesLegal Lines and Disclaime rsNFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL®

LGA1155 Socket20 Thermal/Mechanical Specifications and Design Guidelines3.1 Board LayoutThe land pattern for the LGA1155 socket is 36 mils X 36 mils (

Thermal/Mechanical Specifications and Design Guidelines 21LGA1155 SocketFigure 3-3. LGA1155 Socket Land Pattern (Top View of Board)A C E G J L N R U W

LGA1155 Socket22 Thermal/Mechanical Specifications and Design Guidelines3.1.1 Suggested Silkscreen Marking for Socket IdentificationIntel is recommend

Thermal/Mechanical Specifications and Design Guidelines 23LGA1155 Socket3.3 Socket ComponentsThe socket has two main components, the socket body and P

LGA1155 Socket24 Thermal/Mechanical Specifications and Design GuidelinesCover retention must be sufficient to support the socket weight during lifting

Thermal/Mechanical Specifications and Design Guidelines 25LGA1155 Socket.3.4.1 Socket Standoffs and Package Seating PlaneStandoffs on the bottom of th

LGA1155 Socket26 Thermal/Mechanical Specifications and Design GuidelinesAll markings must withstand 260 °C for 40 seconds (typical reflow/rework profi

Thermal/Mechanical Specifications and Design Guidelines 27Independent Loading Mechanism (ILM)4 Independent Loading Mechanism (ILM)The ILM has two crit

Independent Loading Mechanism (ILM)28 Thermal/Mechanical Specifications and Design Guidelines4.1.2 ILM Back Plate Design OverviewThe back plate is a f

Thermal/Mechanical Specifications and Design Guidelines 29Independent Loading Mechanism (ILM)4.1.3 Shoulder Screw and Fasteners Design OverviewThe sho

Thermal/Mechanical Specifications and Design Guideline 3Contents1Introduction...

Independent Loading Mechanism (ILM)30 Thermal/Mechanical Specifications and Design Guidelines4.2 Assembly of ILM to a MotherboardThe ILM design allows

Thermal/Mechanical Specifications and Design Guidelines 31Independent Loading Mechanism (ILM).Note: Here ILM assembly shown in figure is without ILM c

Independent Loading Mechanism (ILM)32 Thermal/Mechanical Specifications and Design Guidelines4.3 ILM InterchangeabilityILM assembly and ILM back plate

Thermal/Mechanical Specifications and Design Guidelines 33Independent Loading Mechanism (ILM)4.5 ILM CoverIntel has developed an ILM Cover that will s

Independent Loading Mechanism (ILM)34 Thermal/Mechanical Specifications and Design GuidelinesAs indicated in Figure 4-6, the pick and place cover shou

Thermal/Mechanical Specifications and Design Guidelines 35Independent Loading Mechanism (ILM)As indicated in Figure 4-7, the pick and place cover cann

Independent Loading Mechanism (ILM)36 Thermal/Mechanical Specifications and Design Guidelines

Thermal/Mechanical Specifications and Design Guidelines 37LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications5 LGA1155 Sock

LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications38 Thermal/Mechanical Specifications and Design Guidelines5.3 Loading Sp

Thermal/Mechanical Specifications and Design Guidelines 39LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications5.5 Environmen

4 Thermal/Mechanical Specifications and Design Guideline 6.1.4 Intel® Xeon® Processor E3-1220L (20W) Thermal Profile...476.

LGA1155 Socket and ILM Electrical, Mechanical and Environmental Specifications40 Thermal/Mechanical Specifications and Design GuidelinesA detailed des

Thermal/Mechanical Specifications and Design Guidelines 41Thermal Specifications6 Thermal SpecificationsThe processor requires a thermal solution to m

Thermal Specifications42 Thermal/Mechanical Specifications and Design GuidelinesSection 6.2. To ensure maximum flexibility for future processors, syst

Thermal/Mechanical Specifications and Design Guidelines 43Thermal Specifications6.1.1 Intel® Xeon® Processor E3-1280 (95W)Thermal ProfileNotes:1. Plea

Thermal Specifications44 Thermal/Mechanical Specifications and Design Guidelines6.1.2 Intel® Xeon® Processor E3-1200 (80W) Thermal ProfileNotes:1. Ple

Thermal/Mechanical Specifications and Design Guidelines 45Thermal SpecificationsTable 6-3. Thermal Test Vehicle Thermal Profile for Intel® Xeon® Proce

Thermal Specifications46 Thermal/Mechanical Specifications and Design Guidelines6.1.3 Intel® Xeon® Processor E3-1260L (45W) Thermal ProfileNotes:1. Pl

Thermal/Mechanical Specifications and Design Guidelines 47Thermal Specifications6.1.4 Intel® Xeon® Processor E3-1220L (20W) Thermal ProfileNotes:1. Pl

Thermal Specifications48 Thermal/Mechanical Specifications and Design Guidelines6.1.5 Intel® Xeon® Processor E3-1200 (95W) with Integrated Graphics Th

Thermal/Mechanical Specifications and Design Guidelines 49Thermal Specifications6.1.6 Processor Specification for Operation Where Digital Thermal Sens

Thermal/Mechanical Specifications and Design Guideline 511 Thermal Solution Quality and Reliability Requirements...

Thermal Specifications50 Thermal/Mechanical Specifications and Design GuidelinesNotes:1. The ambient temperature is measured at the inlet to the proce

Thermal/Mechanical Specifications and Design Guidelines 51Thermal SpecificationsNotes:1. The ambient temperature is measured at the inlet to the proce

Thermal Specifications52 Thermal/Mechanical Specifications and Design GuidelinesNotes:1. The ambient temperature is measured at the inlet to the proce

Thermal/Mechanical Specifications and Design Guidelines 53Thermal SpecificationsNotes:1. The ambient temperature is measured at the inlet to the proce

Thermal Specifications54 Thermal/Mechanical Specifications and Design Guidelines6.1.7 Thermal MetrologyThe maximum TTV case temperatures (TCASE-MAX) c

Thermal/Mechanical Specifications and Design Guidelines 55Thermal Specificationscontrol, similar to Thermal Monitor 2 (TM2) in previous generation pro

Thermal Specifications56 Thermal/Mechanical Specifications and Design Guidelinestake place. This sequence of temperature checking and Frequency/VID re

Thermal/Mechanical Specifications and Design Guidelines 57Thermal SpecificationsA small amount of hysteresis has been included to prevent rapid active

Thermal Specifications58 Thermal/Mechanical Specifications and Design Guidelinestransitioning to the minimum frequency and corresponding voltage (usin

Thermal/Mechanical Specifications and Design Guidelines 59Thermal Specifications• The number of cores operating in the C0 state.• The estimated curren

6 Thermal/Mechanical Specifications and Design Guideline 10-1 Mechanical Representation of the Solution...

Thermal Specifications60 Thermal/Mechanical Specifications and Design Guidelines6.4.1 Intel® Turbo Boost Technology Power Control and ReportingWhen op

Thermal/Mechanical Specifications and Design Guidelines 61Thermal Specifications6.4.2 Package Power Control The package power control allows for custo

Thermal Specifications62 Thermal/Mechanical Specifications and Design Guidelines

Thermal/Mechanical Specifications and Design Guidelines 63PECI Interface7 PECI Interface7.1 Platform Environment Control Interface (PECI)7.1.1 Introdu

PECI Interface64 Thermal/Mechanical Specifications and Design Guidelines

Thermal/Mechanical Specifications and Design Guidelines 65Sensor Based Thermal Specification Design Guidance8 Sensor Based Thermal Specification Desig

Sensor Based Thermal Specification Design Guidance66 Thermal/Mechanical Specifications and Design GuidelinesFigure 8-1. Comparison of Case Temperature

Thermal/Mechanical Specifications and Design Guidelines 67Sensor Based Thermal Specification Design Guidance8.2 Sensor Based Thermal SpecificationThe

Sensor Based Thermal Specification Design Guidance68 Thermal/Mechanical Specifications and Design GuidelinesNote: This graph is provided as a referenc

Thermal/Mechanical Specifications and Design Guidelines 69Sensor Based Thermal Specification Design Guidance8.3.2 Thermal Design and ModellingBased on

Thermal/Mechanical Specifications and Design Guideline 7Tables1-1 Reference Documents ...

Sensor Based Thermal Specification Design Guidance70 Thermal/Mechanical Specifications and Design Guidelines• When the DTS value is at or below TCONTR

Thermal/Mechanical Specifications and Design Guidelines 71Sensor Based Thermal Specification Design Guidance8.4.1 DTS 1.1 A New Fan Speed Control Algo

Sensor Based Thermal Specification Design Guidance72 Thermal/Mechanical Specifications and Design GuidelinesNotes:1. ΨCA at “DTS = Tcontrol” is applic

Thermal/Mechanical Specifications and Design Guidelines 73Sensor Based Thermal Specification Design Guidance8.5 System ValidationSystem validation sho

Sensor Based Thermal Specification Design Guidance74 Thermal/Mechanical Specifications and Design Guidelines

751U Thermal Solution9 1U Thermal SolutionNote: The thermal mechanical solution information shown in this document represents the current state of the

1U Thermal Solution76Collaboration thermal solution Ψca (mean+3sigma) is computed to 0.319°C/W at the airflow of 15 CFM. As the Ta b l e 9-1 shown wh

771U Thermal SolutionFigure 9-2. 1U Collaboration Heatsink Performance CurvesTable 9-2. Comparison between TTV Thermal Profile and Thermal Solution Pe

1U Thermal Solution789.2.2 Thermal Solution The collaboration thermal solution consists of two assemblies: heatsink assembly & back plate. Heatsin

791U Thermal Solution9.2.3 AssemblyThe assembly process for the 1U collaboration heatsink with application of thermal interface material begins with p

8 Thermal/Mechanical Specifications and Design Guideline Revision History§Document Number Description Date324973-001 • Initial release of the document

1U Thermal Solution809.3 1U Reference Heatsink 9.3.1 Heatsink PerformanceFor 1U reference heatsink, see Appendix B for detailed drawings. Figure 9-4 s

811U Thermal Solution9.3.3 AssemblyThe assembly process is same as the way described in Section 9.2.3, please refer to it for more details. 9.4 Geomet

1U Thermal Solution82§Figure 9-6. TTV Die Size and OrientationDie CenterlinePackage CenterlineDrawing Not to ScaleAll Dimensions in mm37.537.510.9410.

Thermal/Mechanical Specifications and Design Guidelines 83Active Tower Thermal Solution10 Active Tower Thermal Solution10.1 IntroductionThis active to

Active Tower Thermal Solution84 Thermal/Mechanical Specifications and Design Guidelines10.2 Mechanical Specifications10.2.1 Cooling Solution Dimension

Thermal/Mechanical Specifications and Design Guidelines 85Active Tower Thermal SolutionNote: Diagram does not show the attached hardware for the clip

Active Tower Thermal Solution86 Thermal/Mechanical Specifications and Design GuidelinesThe power header on the baseboard must be positioned to allow t

Thermal/Mechanical Specifications and Design Guidelines 87Active Tower Thermal Solution10.4 Cooling RequirementsThe processor may be directly cooled w

Active Tower Thermal Solution88 Thermal/Mechanical Specifications and Design Guidelines

Thermal/Mechanical Specifications and Design Guidelines 89Thermal Solution Quality and Reliability Requirements11 Thermal Solution Quality and Reliabi

Thermal/Mechanical Specifications and Design Guidelines 9Introduction1 IntroductionThis document is intended to provide guidelines for design of therm

Thermal Solution Quality and Reliability Requirements90 Thermal/Mechanical Specifications and Design Guidelines11.2.1 Recommended Test SequenceEach te

Thermal/Mechanical Specifications and Design Guidelines 91Thermal Solution Quality and Reliability Requirements11.3 Material and Recycling Requirement

Thermal Solution Quality and Reliability Requirements92 Thermal/Mechanical Specifications and Design Guidelines

Thermal/Mechanical Specifications and Design Guidelines 93Component SuppliersA Component SuppliersNote: The part numbers listed below identifies the r

Component Suppliers94 Thermal/Mechanical Specifications and Design GuidelinesThe enabled components may not be currently available from all suppliers.

Thermal/Mechanical Specifications and Design Guidelines 95Mechanical DrawingsB Mechanical DrawingsTa b l e B- 1 lists the mechanical drawings include

Mechanical Drawings96 Thermal/Mechanical Specifications and Design GuidelinesFigure B-1. Socket / Heatsink / ILM Keepout Zone Primary Side for 1U (To

Thermal/Mechanical Specifications and Design Guidelines 97Mechanical DrawingsFigure B-2. Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U (

Mechanical Drawings98 Thermal/Mechanical Specifications and Design GuidelinesFigure B-3. Socket / Processor / ILM Keepout Zone Primary Side for 1U (T

Thermal/Mechanical Specifications and Design Guidelines 99Mechanical DrawingsFigure B-4. Socket / Processor / ILM Keepout Zone Secondary Side for 1U